Package PI/SI Engineer

• Power Integrity (PI) Optimization: Perform DC/AC analysis, including IR Drop and PDN impedance profiling, to ensure stable power delivery under high-frequency dynamic loads.
• Signal Integrity (SI) Analysis: Conduct electromagnetic (EM) simulations to mitigate Crosstalk, Reflection, and Insertion Loss for high-speed interfaces (PCIe Gen6, HBM3E, Ethernet, D2D).
• Innovation Opportunity: Lead the implementation of next-generation packaging solutions (2.5D/3D, Chiplets) and develop automated design flows using advanced optimization techniques.
• Co-work and communicate with DSP for implementation

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