PDN & Power Integrity Analysis: Perform comprehensive PDN analysis including DC/AC frequency-domain analysis (Target Impedance profiling) and time-domain transient simulations to guarantee stable power delivery from the VRM to the die.
NPU Transient Power Management: Analyze and mitigate inrush current and severe $di/dt$ noise caused by the simultaneous switching of massive digital blocks (e.g., MAC arrays) in NPU architectures. Establish and optimize on-die, package, and board-level decoupling capacitor (Decap) strategies to prevent Dynamic Voltage Drop (DVD) and Ground Bounce.
SI Modeling & Simulation: Perform comprehensive Signal Integrity (SI) simulations for high-speed interfaces (LPDDR4/5, PCIe Gen4/5, MIPI, etc.), ensuring optimal eye diagrams and jitter margins.
System-Level Co-Simulation: Conduct Chip-Package-Board (CPB) co-simulations using CPM (Chip Power Model) or equivalent methodologies to evaluate and mitigate cross-talk, EMI/EMC issues, thermal-electrical coupling, and IR drop.
Design Optimization: Establish design guides for PCB/Package stack-ups, high-speed routing, and optimal Decap placement (using optimization tools) to meet strict noise and jitter budgets.
Validation & Correlation: Collaborate with the hardware team to perform lab measurements (using Oscilloscopes, VNA, TDR, and active probes) and correlate physical data with simulation results.
